| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device for improving quality during molding. <P>SOLUTION: Multiple-piece substrates 7 are collectively molded after arranging them on a die so that each corner of a plurality of semiconductor chips 1 is directed to the gate side of a resin molding die. A sealing resin 8 flows along the side of the semiconductor chips 1 tilted at nearly 45° to a flowing direction 12 of the sealing resin 8 when injecting the resin. It allows the sealing resin 8 to go around between the chips while preventing a resin flow from stagnating even between the chips in the chip arrangement direction. Consequently, it is possible to improve the quality of the semiconductor device (a BGA) while preventing formation of voids between the chips. <P>COPYRIGHT: (C)2007,JPO&INPIT |
