| 摘要 |
PROBLEM TO BE SOLVED: To provide a joint structure which reduces a thermal stress caused on a joint face between different members, and prevents an occurrence of cracks when a semiconductor element is jointed to a metal plate, etc. SOLUTION: A semiconductor chip 1 is jointed to an aluminum plate 2, and a zinc body 4 is embedded near four corners of the semiconductor chip 1 in the aluminum plate 2. Even when a temperature change occurs in the semiconductor chip 1 or the aluminum plate 2, a residual stress caused on a joint face between the semiconductor chip 1 and the aluminum plate 2 is mitigated by a thermal stress of the zinc body 4, and in repetitive use, the repetitive fatigue of the aluminum plate 2 is reduced and its lifetime can be prolonged. Accordingly, at the corner of the semiconductor chip 1 on the area 2b of the aluminum plate 2 and in a bonding agent 3 on the area 2b, the occurrence of cracks can be suppressed. COPYRIGHT: (C)2007,JPO&INPIT
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