| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical pickup which can prevent a semiconductor laser and electronic parts from being troubled due to temperature rising by improving a heat dissipation property without obstructing its miniaturization. SOLUTION: A gap is provided between an electronic substrate 11 on which a laser drive integrated circuit 2 driving a semiconductor laser 1 is mounted on a rotation side of the optical disk and the optical pickup mounting the semiconductor laser, by surrounding this gap by a bent part 3a of a heat radiation plate 3 made of metal attached to the laser drive integrated circuit, wind is made to flow in the fixed direction from a high pressure part of a fluid inside the drive to a low pressure part of the fluid of an inner peripheral side of the optical disk, and the electronic substrate and a pickup case 4 simultaneously. COPYRIGHT: (C)2007,JPO&INPIT
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