| 摘要 |
<p>[PROBLEMS] To provide a method and an apparatus suitable for controlling an expanding apparatus, by which pickup performance at the time of picking up each chip of a board-like member separated into chips can be improved. [MEANS FOR SOLVING PROBLEMS] At the time of expanding intervals between chips of a board-like member (semiconductor wafer (11)), which is supported by a ring frame (12) through a first sheet (13) and separated into chips, by stretching the first sheet (13) prior to transferring each chip (C) of the board-like member onto a second sheet, the first sheet (13) is stretched to a prescribed position at a first speed, the first sheet (13) is stretched at a second speed slower than the first speed, while measuring the chip intervals from an image of the semiconductor wafer (11) on the first sheet (13) taken by an image processing means (16), and the chip intervals are expanded by a prescribed quantity.</p> |
