| 摘要 |
<P>PROBLEM TO BE SOLVED: To perform low scratching, while keeping a high polishing speed and flatness. <P>SOLUTION: A conductive material film is polished through the use of a polishing pad composed of a composition, where particles made of a water-soluble resin are dispersed in a non-water-soluble cross-linking structural body made of cross-linking rubber or a cross-linked thermal curing resin; and a polishing solution contains inorganic/organic composite particles as a polishing solution. <P>COPYRIGHT: (C)2007,JPO&INPIT |
