| 摘要 |
PROBLEM TO BE SOLVED: To prevent formation of resin burrs on the front surface of substrate by simplifying total structure of die to form a resin seal of electronic component loaded on the substrate, and by absorbing fluctuation in thickness of substrate at the time of forming the resin seal of electronic component. SOLUTION: The resin seal forming apparatus is constituted by forming a die 110 to form resin seal of electronic component from a first die 111 and a second die 112, and by laminating and allocating, to the die contact surface P, L of both dies, a die structure unit (die 110) of a plurality of units in which a substrate supplying part (substrate supplying set surface 113) is provided for supplying a single sheet of preliminary substrate 400 loading electronic component. Moreover, a die closing mechanism (press frame mechanism 130) is also arranged to simultaneously apply the die tightening pressure to the laminated by arranged die structure unit (die 110). COPYRIGHT: (C)2007,JPO&INPIT |
