| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming a pattern achieving space saving because a step of carrying out/in a substrate from/to a coating device can be eliminated and preparation of a device for heating a substrate is unnecessary. SOLUTION: A method for forming a resist pattern is provided that comprises applying a resist pattern reducing material on a patterned surface of a resist and modifying the surface of the resist pattern to form a modified layer to change the dimension of the resist pattern. The method includes steps of: conveying a substrate with a resist pattern formed thereon to a substrate mount base of a coating device; heating the resist pattern reducing material supplied to the coating device, by a nozzle of the coating device near the opening of the nozzle which drops the resist pattern reducing material; and dropping the heated resist pattern reducing material onto the resist pattern of the substrate; forming a modified layer on the resist pattern by the resist pattern reducing material; removing the resist pattern reducing material or the resist pattern reducing material with the modified layer so as to reduce the dimension of the resist pattern into a second dimension. The steps after the substrate is conveyed to the step of reducing the pattern are carried out without moving the substrate from the coating device. Preferably, the method further includes a step of heating the substrate conveyed to the substrate mount base of the coating device to the same temperature as the heating temperature of the resist pattern reducing material, prior to the step of dropping the resist pattern reducing material. COPYRIGHT: (C)2007,JPO&INPIT |
