| 摘要 |
An interconnect substrate 10 includes an insulating resin layer 12 (base material), an interconnect 14 and an electrode pad 16 . On the insulating resin layer 12 , the interconnect 14 and the electrode pad 16 are provided. The interconnect 14 and the electrode pad are integrally formed. A first metal material, exposed in the surface S 1 of the electrode pad 16 opposite to the insulating resin layer 12 and constituting the electrode pad 16 , has higher free energy for forming an oxide than a second metal material, exposed in the surface S 2 of the interconnect 14 opposite to the insulating resin layer 12 and constituting the interconnect 14.
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