发明名称 |
METHODS AND APPARATUSES FOR IMPLEMENTING MULTI-VIA HEATER CHIPS |
摘要 |
<p>A heater chip for use in a printing device that includes a first heater array with a left side and a right side and a first ink via placed on the left side of the first heater array. The chip also includes a second heater array with a left side and a right side, where a right side of the first heater array faces the left side of the second heater array, a second ink via placed on the right side of the second heater array, and at least one logic array is disposed between the first heater array and the second heater array.</p> |
申请公布号 |
WO2007041177(A1) |
申请公布日期 |
2007.04.12 |
申请号 |
WO2006US37732 |
申请日期 |
2006.09.28 |
申请人 |
KING, DAVID, G.;LEXMARK INTERNATIONAL, INC |
发明人 |
KING, DAVID, G. |
分类号 |
B21D53/76;B41J2/05 |
主分类号 |
B21D53/76 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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