The present invention is directed to semiconductor wafer processing to provide semiconductor wafers having reduced defects. More specifically, the present invention is directed to semiconductor wafer processing to provide semicondutor wafers having reduced defects processed in wafer holding articles with reduced surface roughness.
申请公布号
KR20070038935(A)
申请公布日期
2007.04.11
申请号
KR20060098173
申请日期
2006.10.09
申请人
ROHM AND HAAS ELECTRONIC MATERIALS, L.L.C.
发明人
GOELA JITENDRA S.;PICKERING MICHAEL A.;FAHEY JAMES T.;STRICKLAND MELINDA S.
