发明名称
摘要 A printed circuit board is disclosed which has conductive pads located near an edge of a board main body on its upper and lower surfaces to reduce the width in the direction of contact sliding and to provide for a smoother connection between electrical contacts of an electrical connector and the conductive pads despite a powdered substance produced as a result of friction between the conductive pads and the electrical contacts. The printed circuit board (1) has conductive pads (14a, 14b) on upper and lower surfaces of the board main body (2) near the edge (3) of the main body (2). Electrical contacts (20) slide over the conductive pads (14a, 14b) from the edge (3) of the board main body (2). The conductive pads (14a, 14b) are connected together by via holes (15a) that are located in the paths of the contacts (20).
申请公布号 JP3904321(B2) 申请公布日期 2007.04.11
申请号 JP19980082898 申请日期 1998.03.13
申请人 发明人
分类号 H05K1/11;H05K3/42 主分类号 H05K1/11
代理机构 代理人
主权项
地址