发明名称 Cobalt silicidation process for substrates with a silicon-germanium layer
摘要 A method comprises providing a semiconductor alloy layer on a semiconductor substrate, forming a gate structure on the semiconductor alloy layer, forming source and drain regions in the semiconductor substrate on both sides of the gate structure, removing at least a portion of the semiconductor alloy layer overlying the source and drain regions, and forming a metal silicide region over the source and drain regions.
申请公布号 US7202122(B2) 申请公布日期 2007.04.10
申请号 US20040710012 申请日期 2004.06.11
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 HUANG CHIEN-CHAO;YEO YEE-CHIA;WANG CHAO-HSIUNG;LIN CHUN-CHIEH;HU CHENMING
分类号 H01L21/336;H01L21/285;H01L21/8238;H01L29/10 主分类号 H01L21/336
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