| 发明名称 |
Semiconductor wafer, semiconductor chip and method for manufacturing the same |
| 摘要 |
In a semiconductor device, in which an insulating layer is disposed on the main face of the silicon substrate, and the insulating layer includes the protruding portion that protrudes from the end face of the silicon substrate, the protruding portion has an interconnect of Cu embedded within the insulating layer. |
| 申请公布号 |
US7202108(B2) |
申请公布日期 |
2007.04.10 |
| 申请号 |
US20050079383 |
申请日期 |
2005.03.15 |
| 申请人 |
NEC ELECTRONICS CORPORATION |
发明人 |
SOEJIMA KOJI |
| 分类号 |
H01L21/00;H01L21/66;H01L21/301;H01L21/3205;H01L21/68;H01L21/78;H01L23/482;H01L23/52;H01L23/58 |
主分类号 |
H01L21/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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