| 摘要 |
A microstrip interconnector includes a ground plane layer, a dielectric layer coupled to the ground plane layer and a spring conductor, and provides a solderless connection between circuit boards. The spring conductor has first and second rising arms with a midsection therebetween. The midsection couples to the dielectric layer opposite the ground plane layer, defining a first elevation. First and second contacts proximate distal ends of the first and second arms, respectively, define at least one second elevation. The solderless interconnection is for example provided when the ground plane layer, the dielectric layer and the spring conductor cooperatively interact to provide a matched impedance path from the first contact, proximate a microstrip of a first circuit board, to the second contact, proximate a microstrip of a second circuit board that is separated from the first circuit board by a gap. The microstrip interconnector thus facilitates the transfer of microwave signals between the separated microstrips.
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