发明名称 Semiconductor structure with metal migration semiconductor barrier layers and method of forming the same
摘要 A semiconductor structure includes a semiconductor substrate, a semiconductor active region, a semiconductor contact layer, at least one metal migration semiconductor barrier layer, and a metal contact. The metal migration semiconductor barrier layer may be embedded within the semiconductor contact layer. Furthermore, the metal migration semiconductor barrier layer may be located underneath or above and in intimate contact with the semiconductor contact layer. The metal migration semiconductor barrier layer and the semiconductor contact layer form a contact structure that prevents metals from migrating from the metal contact into the semiconductor active layer during long-term exposure to high temperatures. By providing a robust contact structure that may be used in semiconductor structures, for example in solar cells that power spacecraft or terrestrial solar cells used under concentrated sunlight, the high temperature reliability of the semiconductor structure will be improved and the operation time will be prolonged.
申请公布号 US7202542(B2) 申请公布日期 2007.04.10
申请号 US20030739755 申请日期 2003.12.17
申请人 THE BOEING COMPANY 发明人 YOON HOJUN;KING RICHARD;KUKULKA JERRY R.;ERMER JAMES H.;LAU MAGGY L.
分类号 H01L27/14;H01L23/48 主分类号 H01L27/14
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