发明名称 |
In-situ chemical-mechanical planarization pad metrology using ultrasonic imaging |
摘要 |
Chemical-mechanical planarization (CMP) apparatus and methods for detecting polishing pad properties using ultrasonic imaging is presented. An ultrasonic probe assembly transmits ultrasonic signals onto the surface of a polishing pad during a CMP process. Reflected ultrasonic signals are collected and analyzed to monitor polishing pad properties in real-time. This allows CMP process adjustments to be made during the CMP process.
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申请公布号 |
US7201632(B2) |
申请公布日期 |
2007.04.10 |
申请号 |
US20040970338 |
申请日期 |
2004.10.21 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
ELLEDGE JASON B |
分类号 |
B24B37/04;G01N29/07;G01N29/28;H01L21/00 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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