| 摘要 |
FIELD: devices and methods for determining orientation of crystallographic plane relatively to crystal surface, and also device and method for cutting mono-crystal in cutting machine. ^ SUBSTANCE: in accordance to method, angle, formed between crystal surface being measured and base axis, is measured, and angle, formed between crystallographic surface and base axis, and measured angles are subtracted. Then, in device for wire sawing, containing X-Y adjustment device, required correction is performed by measuring orientation and at the same time crystal is moved in horizontal and vertical positions. As a result, additional degree of freedom remains for rotation of crystal in cutting plane to achieve cut, unaffected by forces, perpendicular to feeding direction and wire direction, so that tool deflection is absent, or cutting forces are minimal. ^ EFFECT: increased cutting precision, and simultaneously increased output of plates during mono-crystal cutting. ^ 4 cl, 12 dwg |
