发明名称 SOLID STATE IMAGING DEVICE, SEMICONDUCTOR WAFER AND CAMERA MODULE
摘要 <p>A light-permeable lid provided oppositely to a photodetector of a solid-state imaging element includes a glass substrate, and an infrared-ray shielding film formed on one side of the glass substrate. The light-permeable lid is disposed so that the side of the light-permeable lid (glass substrate) forming the infrared-ray shielding film is positioned at the opposite side of the side facing the photodetector of the solid-state imaging element. If dust mixes in the infrared-ray shielding film or dust deposits to the film, since the distance from the photodetector to dust (infrared-ray shielding film) is longer, the photodetector is less susceptible to adverse influence of the dust and occurrence of defect due to the dust can be decreased.</p>
申请公布号 KR100705349(B1) 申请公布日期 2007.04.09
申请号 KR20050046711 申请日期 2005.06.01
申请人 发明人
分类号 H01L27/14;H01L27/146;H01L31/0203;H04N5/225;H04N5/335;H04N5/372;H04N5/374 主分类号 H01L27/14
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