发明名称 |
METHOD FOR FORMING HIGHLY-ORIENTATED SILICON FILM, METHOD FOR FABRICATING 3D SEMICONDUCTOR DEVICE, AND 3D SEMICONDUCTOR DEVICE |
摘要 |
Provided are methods of forming a highly oriented silicon film and a three-dimensional semiconductor device, and a three-dimensional semiconductor device. The method of forming a highly oriented silicon film includes forming a highly oriented AIN film oriented in a predetermined direction on a substrate, forming a highly oriented Al 2 O 3 layer on a surface of the AIN film by oxidizing the highly oriented AIN film, and growing a silicon film on the highly oriented Al 2 O 3 layer. |
申请公布号 |
KR100707215(B1) |
申请公布日期 |
2007.04.06 |
申请号 |
KR20060037219 |
申请日期 |
2006.04.25 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
WENXU XIANYU;PARK, YOUNG SOO;LEE, JUN HO;LIM, HYUCK;CHOHANS, SE YOUNG;HUAXIANG YIN |
分类号 |
H01L21/20 |
主分类号 |
H01L21/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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