发明名称 METHOD FOR FORMING HIGHLY-ORIENTATED SILICON FILM, METHOD FOR FABRICATING 3D SEMICONDUCTOR DEVICE, AND 3D SEMICONDUCTOR DEVICE
摘要 Provided are methods of forming a highly oriented silicon film and a three-dimensional semiconductor device, and a three-dimensional semiconductor device. The method of forming a highly oriented silicon film includes forming a highly oriented AIN film oriented in a predetermined direction on a substrate, forming a highly oriented Al 2 O 3 layer on a surface of the AIN film by oxidizing the highly oriented AIN film, and growing a silicon film on the highly oriented Al 2 O 3 layer.
申请公布号 KR100707215(B1) 申请公布日期 2007.04.06
申请号 KR20060037219 申请日期 2006.04.25
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 WENXU XIANYU;PARK, YOUNG SOO;LEE, JUN HO;LIM, HYUCK;CHOHANS, SE YOUNG;HUAXIANG YIN
分类号 H01L21/20 主分类号 H01L21/20
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