| 摘要 |
PURPOSE: A semiconductor package and a method for fabricating the same are provided to laminate semiconductor chips by using a circuit film member. CONSTITUTION: A lower chip(22) is adhered on a bottom face of a resin film(12) by using an adhesive member(24). A bonding pad is formed on a center of the lower chip(22). The bonding pad of the lower chip(22) is exposed by a cavity. A tap bonding conductive pattern(14) is extended to the cavity of the resin film(12). The conductive pattern(14) is adhered to the bonding pad of the lower chip by bending one end portion of the conductive pattern(14). A flip chip(26) is adhered to a flip chip bonding conductive pattern(38). An upper chip(20) is adhered to the flip chip(26), the exposed lower chip(22) and the tap bonding conductive pattern(14), the flip chip(26), the flip chip bonding conductive pattern(38), and a side of the upper chip(20) are encapsulated by using a coating material(32). A fetch portion(30) is adhered to a fetch bonding conductive pattern(16). |
