| 摘要 |
PROBLEM TO BE SOLVED: To provide a forming method of conductive joint by applying a technique of forge welding for bonding a metal surface of a metal layer to a conductive bonding layer, when conductive-bonding the surfaces of two metal layers via a conductive bonding layer composed of metallic nanoparticles. SOLUTION: A dispersion liquid of metallic nanoparticles having a molecular layer of a coating agent on the surface thereof is coated on the metal surface of one of metal layers. Then, an organic solvent contained in the coated layer is vaparized to obtain a dry coated layer. The conductive bonding layer is formed by removal of the molecular layer of the coating agent and interactive fusion of metallic nanoparticles through heat treatment at 150°C and under in an atmosphere of high-frequency plasma. A metallic bonding is formed between the surface of the conductive bonding layer and the surface of the metal composing the other metal layer, by applying a heat treatment at 100°C-200°C while forcibly pressing the metal surface of the other metal layer on the surface of the conductive bonding layer. COPYRIGHT: (C)2007,JPO&INPIT
|
