| 摘要 |
On a substrate ( 2 ), a first package ( 4 ) is mounted through bumps ( 3 ), and a second package ( 6 ) is stacked on the first package ( 4 ). Each of the bumps ( 3 ) includes: a resin core ( 3 a) having elasticity; and metal layers formed on an outer surface of the resin core. The bumps ( 3 ) are arranged so as to provide an electrical connection between the substrate ( 2 ) and the first package ( 4 ). With the above structure, a stacked semiconductor device is realized in which an IC chip breaks less likely during a mounting process.
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