发明名称 |
Substrate for flexible wiring and method for producing the same |
摘要 |
The present invention provides a substrate for flexible wiring comprises a liquid crystalline polyester layer and a copper foil with a thickness of 5 mum or less. The substrate has a large adhesion between the resin layer and the copper foil, and is sufficient in water absorbing property and electrical properties.
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申请公布号 |
US2007077416(A1) |
申请公布日期 |
2007.04.05 |
申请号 |
US20060541576 |
申请日期 |
2006.10.03 |
申请人 |
SUMITOMO CHEMICAL COMPANY, LIMITED |
发明人 |
ITO TOYONARI;OKAMOTO SATOSHI |
分类号 |
B32B15/20;B05D3/02;B05D5/12;B32B15/09 |
主分类号 |
B32B15/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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