发明名称 Substrate for flexible wiring and method for producing the same
摘要 The present invention provides a substrate for flexible wiring comprises a liquid crystalline polyester layer and a copper foil with a thickness of 5 mum or less. The substrate has a large adhesion between the resin layer and the copper foil, and is sufficient in water absorbing property and electrical properties.
申请公布号 US2007077416(A1) 申请公布日期 2007.04.05
申请号 US20060541576 申请日期 2006.10.03
申请人 SUMITOMO CHEMICAL COMPANY, LIMITED 发明人 ITO TOYONARI;OKAMOTO SATOSHI
分类号 B32B15/20;B05D3/02;B05D5/12;B32B15/09 主分类号 B32B15/20
代理机构 代理人
主权项
地址