| 发明名称 |
AQUEOUS POLISHING PAD WITH IMPROVED ADHESION AND ITS MANUFACTURING METHOD |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an aqueous polishing pad with uniform density and porosity as well as reduced polishing defect rate and improved polishing performance. <P>SOLUTION: The chemical and mechanical polishing pad comprises a polymer matrix which is formed by an aqueous polymer with microscopic balls dispersed in its inside or its blended material. <P>COPYRIGHT: (C)2007,JPO&INPIT |
| 申请公布号 |
JP2007088464(A) |
申请公布日期 |
2007.04.05 |
| 申请号 |
JP20060252243 |
申请日期 |
2006.09.19 |
| 申请人 |
ROHM & HAAS ELECTRONIC MATERIALS CMP HOLDINGS INC |
发明人 |
DUONG CHAU H |
| 分类号 |
B24D99/00;H01L21/304;B24B37/24 |
主分类号 |
B24D99/00 |
| 代理机构 |
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