METHOD FOR MANUFACTURING SUBSTRATE PROVIDED WITH CAVITY

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a substrate provided with a cavity which can mount a plurality of integrated circuits by reducing the thickness of the substrate in a package-on-package.

SOLUTION: The method of manufacturing a substrate is proposed which comprises (a) a step of forming a first circuit pattern on one surface of a seed layer by using a first dry film; (b) a step of vapor-depositing a second dry film having the thickness corresponding to the thickness of the cavity to be formed, on an area where the cavity is formed on the first dry film; (c) a step of vapor-depositing an insulated layer having the thickness corresponding to the thickness of the cavity to be formed, on an area other than an area where the cavity is to be formed; (d) a step of vapor-depositing a copper foil laminated master plate having a second circuit pattern formed on the insulated layer; and (e) a step of forming the cavity by peeling off the first and second dry films after removing the seed layer by etching.

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