| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thin, compact, and cheap stacked semiconductor device. <P>SOLUTION: The stacked semiconductor device 1 has a wiring board 2 having a plurality of outer electrode terminals 4 on the underside, and a plurality of semiconductor devices 3 mounted on the upside of the wiring board one above another. Each semiconductor device has a flexible wiring board 5, and a semiconductor chip 6 mounted on one side of the flexible wiring board. The flexible board has drawing parts 8 extending in several directions from a body 7 to which the semiconductor chip is fixed. The drawing parts are bent down by one step to form legs 11 with the top ends forming a flat connecting zone, and electrodes are provided on the upside and underside of the connecting zone. The electrodes on the underside of the connecting zone of the lowermost step semiconductor device 3a among the plurality of semiconductor devices are electrically connected to lands provided on the wiring board, and the electrodes on the underside of the connecting zone of other semiconductor devices than the lowermost step semiconductor device are electrically connected to the electrodes on the upsides of the connecting zones of the semiconductor devices located on the lower steps. <P>COPYRIGHT: (C)2007,JPO&INPIT |
