发明名称 METHOD FOR PRODUCING SURFACE ACOUSTIC WAVE ELEMENT PIECE, ANODIZATION METHOD, AND WAFER
摘要 PROBLEM TO BE SOLVED: To provide a method for producing a surface acoustic wave element piece where, even if the distance between a contact electrode and the solution face of an electrolytic solution is made short, a short circuit is not generated between the contact electrode and the electrolytic solution, to provide an anodization method, and to provide a wafer. SOLUTION: In the method for producing a surface acoustic wave element piece having a process of subjecting an electrode pattern 14 of a surface acoustic wave element piece formed in a wafer 12 to anodization, to the lower side of the part to be contacted with a contact electrode 18 by being exposed from the electrolytic solution in a conduction pattern 16 provided at the wafer 12 in contact with the electrode pattern 14, at least a part of a solution prevention pattern 32 of blocking the creeping-up of the electrolytic solution is exposed from the electrolytic solution, so as to perform anodization. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007084872(A) 申请公布日期 2007.04.05
申请号 JP20050274297 申请日期 2005.09.21
申请人 SEIKO EPSON CORP 发明人 YOSHIZAWA GEN;MITSUI YUJI;KURATA YOICHI
分类号 C25D11/00;H03H3/08 主分类号 C25D11/00
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