| 发明名称 |
Adhesive system for supporting thin silicon wafer |
| 摘要 |
In some embodiments, an adhesive system for supporting thin silicon wafer is presented. In this regard, a method is introduced to bond a silicon wafer to a translucent carrier through the use of an adhesive. Other embodiments are also disclosed and claimed.
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| 申请公布号 |
US2007077728(A1) |
申请公布日期 |
2007.04.05 |
| 申请号 |
US20050241499 |
申请日期 |
2005.09.30 |
| 申请人 |
KULKARNI SUDHAKAR N;ARANA LEONEL R;PRACK EDWARD R |
发明人 |
KULKARNI SUDHAKAR N.;ARANA LEONEL R.;PRACK EDWARD R. |
| 分类号 |
H01L21/30;H01L21/46 |
主分类号 |
H01L21/30 |
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