METHOD FOR MANUFACTURING SUBSTRATE PROVIDED WITH CAVITY

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a substrate having a cavity formed thereon which can improve efficiency of substrate manufacturing processes by manufacturing a substrate provided with a cavity using both surfaces of a seed layer.

SOLUTION: The method of manufacturing a substrate having a cavity formed thereon is proposed, which comprises (a) a step of forming a first circuit pattern on both sides of the seed layer by using a first dry film in order to form a circuit pattern on both surfaces; (b) step of vapor-depositing a second dry film having the thickness corresponding to the thickness of the cavity to be formed, on an area where the cavity is formed on the first dry film on both the surfaces of the seed layer; (c) step of vapor-depositing an insulated layer having the thickness corresponding to the thickness of the cavity to be formed, on an area other than the area where the cavity is to be formed on both sides of the seed layer; (d) step of vapor-depositing a copper foil laminated master plate having a second circuit pattern formed on each of the insulated layers; and (e) step of forming the cavity by peeling off the first and the second dry films after removing the seed layer.

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