POSITIVE PHOTOSENSITIVE COMPOSITION, COMPOUND FOR USE IN THE POSITIVE PHOTOSENSITIVE COMPOSITION, RESIN FOR USE IN THE POSITIVE PHOTOSENSITIVE COMPOSITION AND PATTERN FORMING METHOD USING THE POSITIVE PHOTOSENSITIVE COMPOSITION

摘要

PROBLEM TO BE SOLVED: To provide a positive photosensitive composition which improves line edge roughness and pattern collapse even in formation of a fine pattern of ≤100 nm, a compound for use in the positive photosensitive composition, a resin for use in the positive photosensitive composition and a pattern forming method using the positive photosensitive composition.

SOLUTION: The positive photosensitive composition contains (A) a compound capable of generating an acid upon irradiation with an actinic ray or radiation and (B) a resin which is decomposed by the action of an acid to increase solubility in an alkali developer, wherein the resin (B) has a repeating unit having a cyclic hydrocarbon structure and a specific partial structure in the same repeating unit. There are also provided the compound for use in the positive photosensitive composition, the resin for use in the positive photosensitive composition and the pattern forming method using the positive photosensitive composition.

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