发明名称 EMBEDDED CAPACITOR CORE HAVING MULTILAYER STRUCTURE
摘要 <p><P>PROBLEM TO BE SOLVED: To achieve a long wiring path between an IC and an external capacitor. <P>SOLUTION: An embedded capacitor core includes a first set of capacitors, a second set of capacitors, and an interlayer dielectric film between the first set of capacitors and the second set of capacitors. The first set of capacitors includes a first conductive pattern comprising at least two conductive electrodes, a second conductive pattern comprising at least two conductive electrodes corresponding to the two conductive electrodes of the first conductive pattern, and a first dielectric film between the first conductive pattern and the second conductive pattern. The second set of capacitors includes a third conductive pattern comprising at least two conductive electrodes, a fourth conductive pattern comprising at least two conductive electrodes corresponding to the two conductive electrodes of the third conductive pattern, and a second dielectric film between the third conductive pattern and the fourth conductive pattern. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2007088461(A) 申请公布日期 2007.04.05
申请号 JP20060249133 申请日期 2006.09.14
申请人 IND TECHNOL RES INST 发明人 WU SHIH-HSIEN;LEE MIN-LIN;LAY SHINN-JUH;CHANG CHI-HAO
分类号 H01G2/06;H01G4/30;H05K3/46 主分类号 H01G2/06
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