| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an IC package structure in which high heat produced from a chip is effectively removed through a substrate, and which is capable of preventing the occurrence of warpage, crack, and chip coming-off by reducing stress caused by a difference of thermal expansion coefficients of a chip and the substrate. <P>SOLUTION: The IC package structure comprises a substrate 1, a chip 2, a plurality of solder balls 3, and a base filling member 4. The substrate 1 is made of a metal material (copper or aluminum). The plurality of the solder balls 3 are disposed between the chip 2 and the substrate 1 such that their upper edges and lower edges are connected with the chip 2 and the substrate 1, respectively, to improve heat dispersion efficiency. The base filling member 4 comprising a low melting point metal alloy is disposed between the chip 2 and the substrate 1 for supplying a buffer function to effectively absorb deformation of the substrate 1 and the chip 2. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
