发明名称 |
IC coolant microchannel assembly with integrated attachment hardware |
摘要 |
An apparatus includes a microchannel structure that has microchannels formed therein. The microchannels are for transporting a coolant and are intended to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. The apparatus further includes a cover positioned on the microchannel structure. The cover has formed therein a right-angle passage to provide fluid communication between a first port on a lower horizontal surface of the cover and a second port on a vertical surface of the cover. The cover includes a plurality of tabs. Each tab extends from a respective corner of the cover. The tabs each have an aperture formed therein. The apertures are shaped and sized to receive a fastener.
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申请公布号 |
US2007076374(A1) |
申请公布日期 |
2007.04.05 |
申请号 |
US20050239957 |
申请日期 |
2005.09.30 |
申请人 |
MONGIA RAJIV K;POKHARNA HIMANSHU;DISTEFANO ERIC;MCEUEN SHAWN S;WILK BRIAN A |
发明人 |
MONGIA RAJIV K.;POKHARNA HIMANSHU;DISTEFANO ERIC;MCEUEN SHAWN S.;WILK BRIAN A. |
分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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