| 摘要 |
A method including forming a intermetallic compound including (1) an interfacial reaction product between a solder and a contact point and (2) a reaction species. A method including doping a solder material with a species; and forming a intermetallic compound including an interfacial reaction product between the solder material and a contact point. A system including a computing device including a microprocessor, the microprocessor coupled to a printed circuit board through a substrate, the substrate including a first set of contact points and a second set of contact points, wherein the microprocessor is coupled to the substrate through the first set of contact points, and the substrate is coupled to the printed circuit board through the second set of contact points, wherein at least one of the first set of contact points and the second set of contact points. Also a substrate. |
