| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of an electrostatic chuck with enhanced resistance to plasma and cooling performance of an object to be adsorbed. SOLUTION: In the basic configuration of the electrostatic chuck 20, an insulation film 22 is formed on the surface of a metallic plate 21 by thermal spraying, a dielectric substrate 24 is joined onto the insulation film 22 via an insulating adhesive layer 23, the front side of the dielectric substrate 24 is used for a placing side of the object W to be adsorbed such as a semiconductor wafer, and the lower side is formed with electrodes 25, 25. COPYRIGHT: (C)2007,JPO&INPIT |
