| 摘要 |
PROBLEM TO BE SOLVED: To provide a conveyance tray for a semiconductor wafer which can convey stably the semiconductor wafer in which an MEMS device is cast. SOLUTION: The conveyance tray for the semiconductor wafer includes a base 2c of disk-like profile where the wafer is laid, and an outer wall portion 2b formed in a recess profile in order to fix the semiconductor wafer. The inner periphery of this outer wall portion 2b is provided along the profile of the semiconductor wafer, and shall be designed so that it may be fixed, when the semiconductor wafer is laid. In addition, the base 2c has a front surface provided corresponding to the outer diameter of the semiconductor wafer, and placing the semiconductor wafer, and a rear surface for performing a vacuum adsorption on the occasion of the conveyance. COPYRIGHT: (C)2007,JPO&INPIT |
