| 摘要 |
PROBLEM TO BE SOLVED: To provide a cover for thin plate supporting vessel which can reliably be loaded and unloaded. SOLUTION: The cover 13 for thin plate supporting vessel closes a vessel body 12 of a thin plate supporting vessel 11 for accommodating therein semiconductor wafers. The cover 13 comprises a body 18 forming the cover 13 for thin plate supporting vessel, and a thin plate clamp 28 mounted at the internal surface in the side of vessel body 12 among the body 18 in order to support the semiconductor wafer by pressing the same. At the external side surface of the body 18, a recess 23 is provided to prevent the projection of the body 18 to the external side through absorption of such projection with a repulsion force which the recess receives because it is formed as the part recessed to the internal side, when the thin plate clamp 28 supports the semiconductor wafer by pressing the same. This recess 23 is formed in the depth to absorb such projection. COPYRIGHT: (C)2007,JPO&INPIT |
