发明名称 METHOD FOR MANUFACTURING BOARD WITH RECESSED PORTION, AND BOARD WITH RECESSED PORTION
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a board with recessed portions on which a plurality of recessed portions having different depths are simply formed with high dimensional accuracy, and the board with recessed portions manufactured by the manufacturing method. SOLUTION: Related to the board 10 with recessed portions, an inorganic film 2 and a resist film having roughly the same patterns are formed on a substrate 1. A part of the resist film is removed by exposing and developing to form a resist remaining film 31. The resist remaining film 31 is heated to be temporarily melted or softened, and then a part of the resist remaining film 31 which is shrunk in the exposing and developing is restored to be matched with the pattern of the inorganic film 2 disposed just under the part. The resist remaining film 31 in the melted or softened condition is cured. The substrate 1 exposed from the inorganic film 2 is removed to form a first recessed portion 11. The inorganic film 2 exposed from the resist remaining film 31 is removed to form an inorganic remaining film 21. The substrate 1 exposed from the inorganic remaining film 21 is removed to enlarge the depth of the first recessed portion 11 and to form a second recessed portion 12. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007083526(A) 申请公布日期 2007.04.05
申请号 JP20050274766 申请日期 2005.09.21
申请人 SEIKO EPSON CORP 发明人 FUJIMORI OSAMU
分类号 B41J2/16 主分类号 B41J2/16
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