发明名称 Semiconductor device with semi-insulating substrate portions and method for forming the same
摘要 A method for forming semi-insulating portions in a semiconductor substrate provides depositing a hardmask film over a semiconductor substructure to a thickness sufficient to prevent charged particles from passing through the hardmask. The hardmask is patterned creating openings through which charged particles pass and enter the substrate during an implantation process. The semi-insulating portions may extend deep into the semiconductor substrate and electrically insulate devices formed on opposed sides of the semi-insulating portions. The charged particles may advantageously be protons and further substrate portions covered by the patterned hardmask film are substantially free of the charged particles.
申请公布号 US2007077697(A1) 申请公布日期 2007.04.05
申请号 US20050241574 申请日期 2005.09.30
申请人 LIN WEN-CHIN;TANG DENNY;LEE CHUAN-YING;CHENG H C 发明人 LIN WEN-CHIN;TANG DENNY;LEE CHUAN-YING;CHENG H. C.
分类号 H01L21/8238;H01L21/31;H01L21/425 主分类号 H01L21/8238
代理机构 代理人
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