| 摘要 |
PROBLEM TO BE SOLVED: To provide a ceramic circuit board in which the change in warp amount during a thermal shock test of the ceramic circuit board is reduced, and a grease during bonding to a heat dissipation member is restricted from being squeezed out; and to provide a module that employs the same and is excellent in thermal shock resistance. SOLUTION: The ceramic circuit board 1 comprises a ceramic substrate 2, a metal circuit board 3 bonded to one surface of the ceramic substrate 2, and a heat dissipation metal board 4 bonded to the other surface of the ceramic board 2. The metal circuit board 3 includes a circuit pattern 31 for mounting a heating element, and a non-circuit pattern 32 formed on the outer periphery thereof. The difference of the maximum warp amount when the ceramic substrate 1 is left under an atmosphere of 150°C over half an hour, and that when it is left under -55°C is set to be 300μm/inch or lower. COPYRIGHT: (C)2007,JPO&INPIT |
