| 摘要 |
The present invention provides a system and method for detecting thermal events on circuit boards, such as those used in information handling systems. In embodiments of the present invention, a plurality of thermal event detector traces are etched on a printed wire board (PWB) and are isolated from voltage planes in the PWB. In various embodiments of the invention, the thermal event detector traces comprise a pad or trace in a location under or near a component in a critical area. The thermal detection traces or pads are coupled to a detection circuit so that a thermal event resulting in thermal deformation or charring of the PWB in the area of these traces will trigger a power supply shutdown.
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