发明名称 |
Thermosetting resin composition, laminated body using it, and circuit board |
摘要 |
It is an object of the present invention to provide a thermosetting resin composition having satisfactory adhesiveness, good processability, high heat resistance, and excellent dielectric characteristics in the GHz band; and a laminate and a circuit board including the thermosetting resin composition. The present invention provides a thermosetting resin composition including an imide oligomer component (A) containing at least one imide oligomer having a specific structure and an epoxy resin component (B) containing at least one epoxy resin. Furthermore, the present invention provides the thermosetting resin composition further including a polyimide resin component (C).
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申请公布号 |
US2007074896(A1) |
申请公布日期 |
2007.04.05 |
申请号 |
US20060542229 |
申请日期 |
2006.10.04 |
申请人 |
KANEKA CORPORATION |
发明人 |
TANAKA SHIGERU;SHIMOOHSAKO KANJI;ITO TAKASHI;MURAKAMI MUTSUAKI |
分类号 |
H05K1/02;B32B27/34;B32B27/38;C08G59/40;H05K1/03 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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