发明名称 |
Verfahren zum Herstellen eines Halbleiterbauelements mit einem Kunststoffgehäuse |
摘要 |
A process for producing a semiconductor component having a plastic housing in which at least one semiconductor chip is arranged includes providing a semiconductor wafer having semiconductor chips which are arranged in rows and columns and have active top surfaces and back surfaces, the active top surfaces being provided with contact surfaces. The semiconductor wafer are divided into individual semiconductor chips, which are mounted on a carrier plate that has a thermosensitive adhesive on its top surface, such that the active top surfaces of the individual semiconductor chips are placed onto the top surface of the carrier plate. A common carrier is produced from a plastic embedding compound on the carrier plate, with the semiconductor chips being embedded in the plastic embedding compound. The carrier plate is removed by heating the thermosensitive adhesive to a predetermined, defined temperature at which the thermosensitive adhesive loses its adhesive action. |
申请公布号 |
DE10334576(B4) |
申请公布日期 |
2007.04.05 |
申请号 |
DE2003134576 |
申请日期 |
2003.07.28 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
WOERNER, HOLGER;FUERGUT, EDWARD;KALIN, THOMAS;KOBLINSKI, CARSTEN VON |
分类号 |
H01L21/56;H01L21/60;H01L21/68;H01L23/04;H01L23/538 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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