| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed wiring board which ensures the surface flatness and reduces adverse influences to a minimum such as mounting failures due to the board refuse. SOLUTION: The method comprises a step of forming a pattern 3 on a product 2 of a board material 1, coating the surface of the board material 1 with a first resist 6, applying the exposure and developing processes to remove suitably parts of the first resist 6, feeding the pattern 3 with power from a power feed line connected to the pattern 3 through lead wires 7 to form a plating layer 13 on the pattern 3, forming trenches 4 piercing the front side to the backside around the product part 2 except a plurality of thin-width connecting parts 5, coating the surface of the trenches 4 with a second resist 9 after cleaning, and cutting off the connectors to separate spaces outside the trenches 4 from the products 2. COPYRIGHT: (C)2007,JPO&INPIT
|
