EMI SHIELDING DEVICE FOR PCB

摘要

A shielding device is provided for reducing EMI for a PCB. The shielding device includes a plurality of conductive grounded portions arranged on the PCB, an insulating mask, and an auxiliary grounded layer. A plurality of through holes is defined in the insulating mask corresponding to the grounded portions. The auxiliary grounded layer provides a conductive surface. The grounded portions contact the conductive surface via the through holes.