CHAMBER MATCHING METHOD, SEMICONDUCTOR PROCESS ASSISTING DEVICE, MAINTENANCE METHOD, AND MAINTENANCE ASSISTING DEVICE

摘要

A chamber matching method for enabling well chamber matching of a semiconductor processing apparatus for processing a semiconductor substrate with further advanced microfabrication. The chamber matching method comprises a first step of loading a predetermined number of semiconductor substrates equivalently processed in advance into respective semiconductor processing apparatuses and processing them under the same processing condition, a second step of applying electron beams to the respective processed semiconductor substrates and measuring the substrate current of each substrate induced by the electron beam application for obtaining a process evaluation value of the semiconductor substrate, and a third step of varying the processing condition applied to the semiconductor processing apparatuses according to the measurement values of the process evaluation values so that the characteristics of the semiconductor processing apparatuses may match one another.