| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve the connection reliability of a semiconductor chip using wire bonding technology. <P>SOLUTION: A ball bonding operation 21a is carried out as a first connection 21 using a ball formed on the tip of a capillary at the side of a semiconductor chip 15a. A thermocompression bonding operation 22a that crushes and fixes the wire by pressure with the tip of the capillary is carried out as a second connection 22 at the side of a semiconductor chip 15b. Thereafter, a ball is formed on the tip of the capillary at the side of the second connection 22, and a ball bonding operation 22b is carried. As mentioned above, the ball bonding operation 22b is carried out last, whereby the thermocompression bonding 22a is improved in strength. <P>COPYRIGHT: (C)2007,JPO&INPIT |
