| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resist composition superior in line width roughness, and further in resolution and defocusing latitude in contact hole pattern formation and superior in exposure margin, and to provide a pattern forming method using it. <P>SOLUTION: The resist composition contains (A) a resin increasing a dissolution speed to an alkali developer due to the action of an acid having a repeating unit expressed by a general formula (I), and (B) a compound generating the acid due to irradiation with an active light or radiation. <P>COPYRIGHT: (C)2007,JPO&INPIT |
