摘要 |
In conjunction with a process for producing an organic resin covered metal plate by extrusion lamination, there are provided particularly a method for removing an oligomer deposited on a roll with which a heat molten resin comes into contact and an apparatus for producing an organic resin covered metal plate while removing the oligomer. A heat molten organic resin is continuously extruded through a T die into a film onto a continuous strip-shaped metal plate. The molten resin is allowed to be dropped onto and brought into contact with a preroll provided between the T die and the laminate roll, and the molten resin is narrowed by the pressure of the laminate roll to produce an organic resin covered metal plate. In this process, an electric conductor is provided parallel to the widthwise direction of the preroll. In such a state that current is applied to the electric conductor at given time intervals, the molten resin is dropped onto the preroll and is adhered onto the surface of the preroll by electrostatic pinning to transfer an oligomer, deposited onto the preroll, onto the molten resin surface and thus to remove the oligomer. |
申请人 |
TOYO KOHAN CO., LTD.;FUJISAWA, KENICHI;NAKAMURA, TAKUJI;INAZAWA, HIROSHI;MAIDA, NORIMASA;MATSUBARA, YASUHIRO |
发明人 |
FUJISAWA, KENICHI;NAKAMURA, TAKUJI;INAZAWA, HIROSHI;MAIDA, NORIMASA;MATSUBARA, YASUHIRO |