发明名称 PROCESS FOR PRODUCING ORGANIC RESIN COVERED METAL PLATE AND APPARATUS FOR PRODUCING ORGANIC RESIN COVERED METAL PLATE
摘要 In conjunction with a process for producing an organic resin covered metal plate by extrusion lamination, there are provided particularly a method for removing an oligomer deposited on a roll with which a heat molten resin comes into contact and an apparatus for producing an organic resin covered metal plate while removing the oligomer. A heat molten organic resin is continuously extruded through a T die into a film onto a continuous strip-shaped metal plate. The molten resin is allowed to be dropped onto and brought into contact with a preroll provided between the T die and the laminate roll, and the molten resin is narrowed by the pressure of the laminate roll to produce an organic resin covered metal plate. In this process, an electric conductor is provided parallel to the widthwise direction of the preroll. In such a state that current is applied to the electric conductor at given time intervals, the molten resin is dropped onto the preroll and is adhered onto the surface of the preroll by electrostatic pinning to transfer an oligomer, deposited onto the preroll, onto the molten resin surface and thus to remove the oligomer.
申请公布号 WO2007037225(A1) 申请公布日期 2007.04.05
申请号 WO2006JP319050 申请日期 2006.09.26
申请人 TOYO KOHAN CO., LTD.;FUJISAWA, KENICHI;NAKAMURA, TAKUJI;INAZAWA, HIROSHI;MAIDA, NORIMASA;MATSUBARA, YASUHIRO 发明人 FUJISAWA, KENICHI;NAKAMURA, TAKUJI;INAZAWA, HIROSHI;MAIDA, NORIMASA;MATSUBARA, YASUHIRO
分类号 B29C47/02;B29C47/08;B29L7/00 主分类号 B29C47/02
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