PHOTOSENSITIVE RESIN COMPOSITION AND CIRCUIT BOARD USING SAME

摘要

PROBLEM TO BE SOLVED: To provide: a photosensitive polyimide resin composition containing no acid generator and capable of performing heat treatment at a lowered temperature, which is difficult in the case of a conventional polyimide resin; an alkali developable photosensitive cover lay; and a circuit board using the same.

SOLUTION: The photosensitive resin composition developable with an alkaline aqueous solution contains a soluble polyimide having a carboxyl group in a molecule and a photobase generator capable of generating an amino group upon photoirradiation. The circuit board has the photosensitive cover lay using the photosensitive resin composition.

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